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 FFD06UP20S
June 2007
FFD06UP20S
Features
* Ultrafast with soft recovery ( @ IF = 1A), < 35ns * Reverse Voltage, 200V * Forward Voltage ( @ TC = 100oC), < 1V * Enhanced Avalanche Energy * RoHS compliant
Ultrafast Rectifier
tm
Applications
* Power switching circuits * Output rectifiers * Freewheeling diodes * Switching mode power supply
1 2
D-PAK (TO-252)
1. Cathode
2. Anode
Absolute Maximum Ratings TC = 25oC unless otherwise noted
Symbol VRRM IF(AV) IFSM TJ, TSTG Parameter Peak Repetitive Reverse Voltage Average Rectified Forward Current Non-repetitive Peak Surge Current 60Hz Single Half-Sine Wave Operating and Storage Temperature Range @ TC = 125oC Ratings 200 6 60 -65 to +150 Units V A A
o
C
Thermal Characteristics
Symbol RJC Parameter Maximum Thermal Resistance, Junction to Case Ratings 5.1 Units
o
C/W
Package Marking and Ordering Information
Device Marking
F06UP20S
Device
FFD06UP20S
Package
TO-252
Reel Size
13" Dia
Tape Width
-
Quantity
2500
(c)2007 Fairchild Semiconductor Corporation FFD06UP20S Rev. A
1
www.fairchildsemi.com
FFD06UP20S
Electrical Characteristics TC = 25oC unless otherwise noted
Symbol VFM* IRM* trr Irr Qrr trr WAVL Parameter Maximum Instantaneous Forward Voltage IF = 6A IF = 6A Maximum Instantaneous Reverse Current @ rated VR Reverse Recovery Time Reverse Recovery Current Reverse Recovery Charge (IF = 6A, di/dt = 200A/s) Maximum Reverse Recovery Time (IF = 1A, di/dt = 100A/s) Avalanche Energy ( L = 40mH) TC = 25oC TC = 100oC TC = 25oC TC = 100oC Min. 10 Typ. 18.6 2.9 26.8 Max. 1.15 1.0 100 500 35 Units V A ns A nC ns mJ
*Pulse Test: Pulse Width = 300s, Duty Cycle = 2%
Test Circuit and Waveforms
FFD06UP20S Rev. A
2
www.fairchildsemi.com
FFD06UP20S
Typical Performance Characteristics
Figure 1. Typical Forward Voltage Drop vs. Forward Current
50
Figure 2. Typical Reverse Current vs. Reverse Voltage
10
Forward Current, IF [A]
TC = 100 C TC = 25 C
o
o
Reverse Current , IR [A]
10
1
TC = 100 C
o
0.1
TC = 25 C
o
1
0.01
0.1 0.0
0.5 1.0 1.5 Forward Voltage, VF [V]
2.0
1E-3
10
40
80 120 160 Reverse Voltage, VR [V]
200
Figure 3. Typical Junction Capacitance
100
Typical Capacitance at 0V = 91 pF
Figure 4. Typical Reverse Recovery Time vs. di/dt
40
Reverse Recovery Time, trr [ns]
Capacitances , Cj [pF]
75
35
TC = 100 C
o
50
30
25
25
TC = 25 C
o
0 0.1
1 10 Reverse Voltage, VR [V]
100
20 50
100
150 di/dt [A/s]
200
250
Figure 5. Typical Reverse Recovery Current vs. di/dt
6 5 4 3 2
TC = 25 C
o o
Figure 6. Forward Current Derating Curve
20
Average Forward Current, IF(AV) [A]
Reverse Recovery Current, Irr [A]
15
TC = 100 C
10
DC
5
1 0 50
100
150
di/dt [A/s]
200
250
0 25
50
75 100 125 o Case temperature, TC [ C]
150
FFD06UP20S Rev. A
3
www.fairchildsemi.com
FFD06UP20S
Mechanical Dimensions
D-PAK
Dimensions in Millimeters
FFD06UP20S Rev. A
4
www.fairchildsemi.com
TRADEMARKS
The following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. ACEx(R) Build it NowTM CorePLUSTM CROSSVOLTTM CTLTM Current Transfer LogicTM EcoSPARK(R) Fairchild(R) Fairchild Semiconductor(R) FACT Quiet SeriesTM FACT(R) FAST(R) FastvCoreTM FPSTM FRFET(R) Global Power ResourceSM Green FPSTM Green FPSTM e-SeriesTM GTOTM i-LoTM IntelliMAXTM ISOPLANARTM MegaBuckTM MICROCOUPLERTM MicroFETTM MicroPakTM Motion-SPMTM OPTOLOGIC(R) OPTOPLANAR(R)
(R)
PDP-SPMTM Power220(R)
Power247(R) POWEREDGE(R) Power-SPMTM PowerTrench(R) Programmable Active DroopTM QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM SMART STARTTM SPM(R) STEALTHTM SuperFETTM SuperSOTTM-3 SuperSOTTM-6
SuperSOTTM-8 SyncFETTM The Power Franchise(R)
TinyBoostTM TinyBuckTM TinyLogic(R) TINYOPTOTM TinyPowerTM TinyPWMTM TinyWireTM SerDesTM UHC(R) UniFETTM VCXTM
DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD'S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.
LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Product Status Formative or In Design Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Rev. I30
Preliminary
First Production
No Identification Needed
Full Production
Obsolete
Not In Production


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